XILENCE XZ028 Thermal Pad 38x38x0.2mm 1 pc
The XILENCE XZ028 is a thermal conductive pad measuring 38 x 38 mm and 0.2 mm thick, offering a clean alternative to traditional thermal paste. The grey pad fills the microscopic gaps between a processor...
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Product description
The XILENCE XZ028 is a thermal conductive pad measuring 38 x 38 mm and 0.2 mm thick, offering a clean alternative to traditional thermal paste. The grey pad fills the microscopic gaps between a processor or other chip and the heatsink evenly, transferring heat efficiently to the cooler.
Application is simple: there is no need to dispense or spread anything. Simply cut the pad to the required size and place it on the surface. It does not spread out or contaminate components, which makes installation noticeably quicker.
The package contains one pad, which can be used to cool processors, graphics chips, memory modules and other heat-producing components. It is a practical choice for custom builds and for routine maintenance.
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