The Thermal Grizzly Minus Pad Pro is the latest development of the Hamburg Cooling Specialist, which further expands the company's innovative thermal conductivity benches. Built on the basics of the previous Minus Pad 8, it was further developed to significantly increase the heat conductivity. A great alternative instead of a heat conductive paste.

The Minus Pad Pro is well suited for applications where the heat conductivity paste is cumbersome or the distance between the heat source and the heat sink should be bridged. Therefore, it is especially recommended for cooling memory chips and voltage converters. The bench uses a silicone-based carrier complex and aluminum oxide as a heat transfer medium, providing similar heat conductivity to heat conductivity.

The Minus Pad Pro is available in different sizes and thicknesses between 0.5 and 3 mm. Since it works optimally with minimal pressure and the thickness hardly affects the heat conductivity, only the necessary distance should be taken into account when choosing the right size.