With the Thermal Grizzly Minus Pad Basic product, the Hamburg-based cooling technology specialist further expands its range with advanced heat-conducting pads. Building on the foundations of the previous Minus Pad 8, it has been further developed to significantly increase its thermal conductivity.

Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where the distance between the heat source and the heatsink needs to be bridged. It is therefore particularly suitable for memory chips and voltage converters. It uses a silicone-based carrier complex and aluminum oxide as a heat transfer medium, so its thermal conductivity is similar to that of thermal paste.

The Minus Pad is available in different sizes and thicknesses, from 0.5 to 3 millimeters. Since it works optimally even at minimal pressure, and its thickness hardly affects the thermal conductivity, it is enough to consider the required distance when choosing the right size.