With the Advance product of Thermal Grizzly MINUS PAD, the Hamburg cooling technique specialist further expands its offerings with advanced thermal conductors. Built on the basics of the previous Minus Pad 8, it was further developed to significantly increase the heat conductivity.

The Minus Pad Advance is ideal for applications where the heat conductivity paste is difficult to raise or where the distance between the heat source and the heat sink should be bridged. Therefore, it is especially suitable for memory chips and voltage converters. It uses a silicone-based carrier complex and aluminum oxide as a heat transfer medium, so its thermal conductivity is similar to the heat conductive paste.

The minus pad is available in different sizes and thicknesses, between 0.5 and 3 millimeters. Since it works optimally with minimal pressure and the thickness of the thermal conductivity is barely affected, it is sufficient to consider the necessary distance when selecting the right size.