DELOCK Heat conductor pillow 70 x 20 x 1.75 mm M.2 modules 3.0 W/mK nem silicone material
not available
DELOCK Heat conductor pillow 70 x 20 x 1.75 mm M.2 modules 3.0 W/mK nem silicone material
not available
Product description
Description This Delock thermal pad is suitable for distributing heat on, for example, an M.2 module. The purpose of the pad is to improve operation and increase the service life of the parts. The most common areas of application of silicone-free pads are industry and optoelectronics. Non-silicone Silicone-free pads do not emit any oil that can contaminate or damage the components. This makes them ideal for sensitive electronics such as sensors. Silicone-free pads can also be used in a wider temperature environment without losing their properties, which is especially useful for industrial applications with extreme temperatures. In addition to the advantage of a longer service life, they are even more environmentally friendly than conventional heat-conducting pads. Technical data Heat-conducting pad for heat distribution Thermal conductivity: 3.0 W/mKOperating temperature: -60 C ~ 180 C Color: pink Dimensions (LxWxH): approx. 70 x 20 x 1.75 mm Package contents 1 x heat-conducting insert Package Lockable plastic bag Manufacturer: Delock