DELOCK Heat conductor pillow 120 x 20 x 3 mm M.2 modules 3.2 W/mK low oil szivárgás

Description This Delock thermal pad is suitable for distributing heat on, for example, an M.2 module. The purpose of the pad is to improve the operation and increase the service life of the parts. Low oil leakage This pad leaks very little oil, which protects the electronic components and contact elements from contamination and can provide a longer service life. Those pads with low oil emissions retain their thermal and mechanical properties better and thus ensure a balanced and stable heat distribution. Technical data Heat-conducting pad for heat distribution Low oil leakage Thermal conductivity: 3.2 W/mK Operating temperature: -60 C ~ 180 C Color: gray Dimensions (LxWxH): approx. 120 x 20 x 3 mm Package contents 1 x heat-conducting insert Package Lockable plastic bag Manufacturer: Delock